Description

Wafer UV Dicing Tape

Description:

Wafer UV Dicing Tape

* The PO film was single coated with special adhesive which has high adhesion. With this tape, the wafer would not fall off or fly off during grinding and dicing.

* The wafer can be picked up easily after exposing to UV-light.

* There would not be any residue on the surface of wafer which is good for processing.

* High adhesion strength. Can prevent dicing wafer from penetrating into the interface.

* Ideal for package dicing application.

FEATURES: 

Wafer UV Dicing Tape

* Stable

* Good adhesion before UV radiation, easily peeled off after UV radiation

APPLICATION?

Wafer UV Dicing Tape

* This is for package saw like QFN or BGA.

* Mainly used for the package dicing of all kinds of IC wafers.

CONSTRUCTION ?

 Wafer UV Dicing Tape

PHYSICAL PROPERTIES ?