Description

Wafer UV Tape Dicing Tape
Wafer UV Dicing Tape
Description:
Wafer UV Dicing Tape
* The PO film was single coated with special adhesive which has high adhesion. With this tape, the wafer would not fall off or fly off during grinding and dicing.
* The wafer can be picked up easily after exposing to UV-light.
* There would not be any residue on the surface of wafer which is good for processing.
* High adhesion strength. Can prevent dicing wafer from penetrating into the interface.
* Ideal for package dicing application.
FEATURES:
Wafer UV Dicing Tape
* Stable
* Good adhesion before UV radiation, easily peeled off after UV radiation
APPLICATION?
Wafer UV Dicing Tape
* This is for package saw like QFN or BGA.
* Mainly used for the package dicing of all kinds of IC wafers.
CONSTRUCTION ?
Wafer UV Dicing Tape
PO Film |
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Adhesive |
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PET Release Film |
PHYSICAL PROPERTIES ?
Property |
Item |
Unit |
Value |
Test Method |
Material |
Carrier |
Polyolefin |
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Adhesive |
Acylic Adhesive |
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