Wafer UV Tape Dicing Tape

Category:

Description



Wafer UV Tape Dicing Tape

The PO film was single coated with special adhesive which has high adhesion. With this tape, the wafer would not fall off or fly off during grinding and dicing.


    Wafer UV Dicing Tape

    Description:

    Wafer UV Dicing Tape


    * The PO film was single coated with special adhesive which has high adhesion. With this tape, the wafer would not fall off or fly off during grinding and dicing.

    * The wafer can be picked up easily after exposing to UV-light.

    * There would not be any residue on the surface of wafer which is good for processing.

    * High adhesion strength. Can prevent dicing wafer from penetrating into the interface.

    * Ideal for package dicing application.


    FEATURES: 

    Wafer UV Dicing Tape


    * Stable

    * Good adhesion before UV radiation, easily peeled off after UV radiation

     


    APPLICATION?

    Wafer UV Dicing Tape


    * This is for package saw like QFN or BGA.

    * Mainly used for the package dicing of all kinds of IC wafers.



    CONSTRUCTION ?

     Wafer UV Dicing Tape


    PO Film

    Adhesive

    PET Release Film

    PHYSICAL PROPERTIES ?


    Property

    Item

    Unit

    Value

    Test Method

    Material

    Carrier

    Polyolefin

    Adhesive

    Acylic Adhesive